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Consumer‑friendly, Renter‑safe, Smart‑home Ready Remote Switch Adapter Assembly
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RPI ID:
RPI IP 2025‑001‑301
Innovation Summary:
A remote switch adapter assembly is presented that mechanically actuates an existing wall switch without requiring any rewiring, removal, or modification of the electrical fixture. The system uses a plate that couples directly to a standard electrical switch box, with a switch opening...
Published: 3/16/2026
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Updated: 3/16/2026
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Inventor(s): Armando Mora, James McClean, Hayden Mattera, Reese Mount, Evan Owens, Samuel Nassau
Keywords(s): Electronics, Home Devices, Remote Control, Switch Adapter
Category(s): Computational Science and Engineering
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LT-TCP: End-to-End Framework to Improve TCP performance over Networks with Lossy Channels
RPI ID: 2005-012-202
Innovation Summary:
This invention introduces a modified version of the Transmission Control Protocol (TCP) designed to tolerate packet loss in high-bandwidth, high-latency networks. It adjusts congestion control mechanisms to maintain throughput despite losses, ensuring reliable data delivery without sacrificing speed. The protocol...
Published: 9/5/2025
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Updated: 7/7/2025
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Inventor(s): Shivkumar Kalyanaraman, K. K. Ramakrishnan, Vijaynarayanan Subramanian, Omesh Tickoo
Keywords(s): Electrical, Electronics
Category(s): Computational Science and Engineering
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Method of directed self-assembly using diamagnetic levitation
RPI ID: 2015-021-403Innovation Summary:This invention introduces a novel system for directed self-assembly of microscopic electronic components using diamagnetic levitation. Unlike traditional 'pick-and-place' robotics used in electronic assembly, this approach allows components to position themselves using magnetic repulsion. A magnetic stage...
Published: 7/21/2025
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Updated: 7/3/2025
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Inventor(s): Jian-Qiang "James" Lu, Anton Tkachenko
Keywords(s): 2D arrays, Automation, Biomedical Engineering, Diamagnetic Levitation, Electrical Engineering, Electronic components, Electronics, Industrial Engineering, Integrated Chips, LED, LED dies, Lighting / Illumination, Materials, Mechanical Engineering, Optics, Optoelectronic Functionalities, Photonics, Self Assembly, Semiconductors, sparse arrays
Category(s): Energy, Environment and Smart Systems
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Phosphorescent Wavelength‑Shifting Solar Cell for High‑Efficiency Thin‑Film Photovoltaics
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RPI ID:
2015-004
Innovation Summary:
A phosphorescent donor–acceptor solar cell architecture is presented that enhances light‑harvesting efficiency by converting high‑energy photons into wavelengths more effectively absorbed by the acceptor layer. The structure integrates phosphorescent donor particles that capture UV/blue...
Published: 3/10/2026
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Updated: 7/3/2025
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Inventor(s): Vidhya Chakrapani
Keywords(s): Electrical Engineering, Electronics, Remote Operation, Sensors, Software
Category(s): Biotechnology and the Life Sciences
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Method of Selective etching of heavily doped wide-bandgap semiconductosr substrates using Electro Chemical Etching process for different device applications
RPI ID: 2014-023-401 Innovation Summary:This technology presents a method for selectively etching semiconductor layers using electrochemical processing. It targets layers with enhanced conductivity, enabling controlled porosity modification and removal. The technique uses anodic oxidation to create a porous region that can be selectively removed. This...
Published: 7/21/2025
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Updated: 7/3/2025
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Inventor(s): Ishwara Bhat, Tat-Sing Chow, Rajendra Dahal
Keywords(s): Chip manufacturing, Diodes, Doping, Electronics, Engineering, Etching, Material science, Multi-layer, Porosity, Semiconductors
Category(s): Computational Science and Engineering
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