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LT-TCP: End-to-End Framework to Improve TCP performance over Networks with Lossy Channels
RPI ID: 2005-012-202Innovation Summary:This invention introduces a modified version of the Transmission Control Protocol (TCP) designed to tolerate packet loss in high-bandwidth, high-latency networks. It adjusts congestion control mechanisms to maintain throughput despite losses, ensuring reliable data delivery without sacrificing speed. The protocol...
Published: 7/21/2025
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Updated: 7/7/2025
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Inventor(s): Shivkumar Kalyanaraman, K. K. Ramakrishnan, Vijaynarayanan Subramanian, Omesh Tickoo
Keywords(s): Electrical, Electronics
Category(s): Biotechnology and the Life Sciences
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Method of directed self-assembly using diamagnetic levitation
RPI ID: 2015-021-403Innovation Summary:This invention introduces a novel system for directed self-assembly of microscopic electronic components using diamagnetic levitation. Unlike traditional 'pick-and-place' robotics used in electronic assembly, this approach allows components to position themselves using magnetic repulsion. A magnetic stage...
Published: 7/21/2025
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Updated: 7/3/2025
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Inventor(s): Jian-Qiang "James" Lu, Anton Tkachenko
Keywords(s): 2D arrays, Automation, Biomedical Engineering, Diamagnetic Levitation, Electrical Engineering, Electronic components, Electronics, Industrial Engineering, Integrated Chips, LED, LED dies, Lighting / Illumination, Materials, Mechanical Engineering, Optics, Optoelectronic Functionalities, Photonics, Self Assembly, Semiconductors, sparse arrays
Category(s): Energy, Environment and Smart Systems
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Solar Cell Employing Phosphorescent Materials
RPI ID: 2015-004-601Innovation Summary:This solar cell design enhances light absorption efficiency using phosphorescent donor-acceptor structures. The architecture includes acceptor particles that generate photocurrent and donor particles made of phosphorescent materials. These donor particles absorb high-energy photons and re-emit them at longer wavelengths,...
Published: 7/21/2025
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Updated: 7/3/2025
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Inventor(s): Vidhya Chakrapani
Keywords(s): Acoustics, Automation, Bioinformatics, Education, Electrical Engineering, Electronics, IT Hardware, Music, Remote Operation, Robotics, Sensors, Software
Category(s): Biotechnology and the Life Sciences
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Method of Selective etching of heavily doped wide-bandgap semiconductosr substrates using Electro Chemical Etching process for different device applications
RPI ID: 2014-023-401 Innovation Summary:This technology presents a method for selectively etching semiconductor layers using electrochemical processing. It targets layers with enhanced conductivity, enabling controlled porosity modification and removal. The technique uses anodic oxidation to create a porous region that can be selectively removed. This...
Published: 7/21/2025
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Updated: 7/3/2025
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Inventor(s): Ishwara Bhat, Tat-Sing Chow, Rajendra Dahal
Keywords(s): Chip manufacturing, Diodes, Doping, Electronics, Engineering, Etching, Material science, Multi-layer, Porosity, Semiconductors
Category(s): Computational Science and Engineering
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