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3-D printed optics with internal structures
RPI ID:
2018-036-401
Innovation Summary:
This invention introduces a three‑dimensional (3‑D) optical element that is manufactured using additive processes and contains internal or surface beam‑forming features. The optic accepts incident light on a first surface and emits a shaped beam from a second surface; the emitted distribution (wide, narrow,...
Published: 3/10/2026
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Updated: 3/10/2026
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Inventor(s): Nadarajah Narendran, Ukwatte Lokuliyanage Indi Perera
Keywords(s): 3D Printing, Additive Manufacturing, Lighting, Optics
Category(s): Biotechnology and the Life Sciences
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3D Printed Integrated Heatsink-Reflector Light Fixture
RPI ID: 2021-044-401
Innovation Summary:
This invention introduces 3D printed structures that integrate thermal management and light transfer capabilities into a single component. The design includes embedded channels and reflective surfaces that optimize heat dissipation and light guidance. It supports applications in lighting systems, electronics...
Published: 3/23/2026
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Updated: 3/10/2026
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Inventor(s): Jean Paul Freyssinier, Ukwatte Lokuliyanage Indi Perera, Nadarajah Narendran
Keywords(s): 3D Printing, heat sink, Lighting, Optics
Category(s): Nanotechnology and Advanced Materials
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Structured Light Signal Transmission Through Clouds
RPI ID:
2023-050-201
Innovation Summary:
This technology introduces systems for free-space optical communication using modulated light beams to transmit data wirelessly. The system includes adaptive optics and signal processing algorithms to maintain communication integrity across varying environmental conditions. It supports high-bandwidth, low-latency...
Published: 3/10/2026
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Updated: 3/10/2026
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Inventor(s): Moussa N'Gom
Keywords(s): atmosphere, channel, communication, filament, free-space optical communication, FSO, laser, light-based communication, Optics, Satellite, Signals, structured beam, structured light, Transmission
Category(s): Energy, Environment and Smart Systems
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Method of directed self-assembly using diamagnetic levitation
RPI ID: 2015-021-403Innovation Summary:This invention introduces a novel system for directed self-assembly of microscopic electronic components using diamagnetic levitation. Unlike traditional 'pick-and-place' robotics used in electronic assembly, this approach allows components to position themselves using magnetic repulsion. A magnetic stage...
Published: 7/21/2025
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Updated: 7/3/2025
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Inventor(s): Jian-Qiang "James" Lu, Anton Tkachenko
Keywords(s): 2D arrays, Automation, Biomedical Engineering, Diamagnetic Levitation, Electrical Engineering, Electronic components, Electronics, Industrial Engineering, Integrated Chips, LED, LED dies, Lighting / Illumination, Materials, Mechanical Engineering, Optics, Optoelectronic Functionalities, Photonics, Self Assembly, Semiconductors, sparse arrays
Category(s): Energy, Environment and Smart Systems
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