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Method of directed self-assembly using diamagnetic levitation
RPI ID: 2015-021-403Innovation Summary:This invention introduces a novel system for directed self-assembly of microscopic electronic components using diamagnetic levitation. Unlike traditional 'pick-and-place' robotics used in electronic assembly, this approach allows components to position themselves using magnetic repulsion. A magnetic stage...
Published: 7/21/2025
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Updated: 7/3/2025
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Inventor(s): Jian-Qiang "James" Lu, Anton Tkachenko
Keywords(s): 2D arrays, Automation, Biomedical Engineering, Diamagnetic Levitation, Electrical Engineering, Electronic components, Electronics, Industrial Engineering, Integrated Chips, LED, LED dies, Lighting / Illumination, Materials, Mechanical Engineering, Optics, Optoelectronic Functionalities, Photonics, Self Assembly, Semiconductors, sparse arrays
Category(s): Energy, Environment and Smart Systems
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