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Glass Micro-Devices with Optical Waveguides and Micromechanical Features
RPI ID: 2005-037-201Innovation Summary:This invention presents a monolithic translation stage fabricated from a single glass substrate. It seamlessly integrates a moving platform, support frame, and optical transducer into one continuous structure. By eliminating mechanical joints, the design enhances precision and significantly reduces wear and maintenance....
Published: 7/21/2025   |   Updated: 7/7/2025   |   Inventor(s): Philippe Bado, Yves Bellouard, Mark Dugan, Ali Said
Keywords(s): LED, Lighting & Illumination Technology
Category(s): Energy, Environment and Smart Systems
Multispectral daylight sensor to enable energy savings and well-being of occupants
RPI ID: 2016-061-401Innovation Summary:This invention introduces a novel method and sensor system for accurately determining the spectral composition of light at a specific target location. The system uses a multi-channel sensor assembly to capture light data and a computational model to analyze the spectral power distribution (SPD) of the light source....
Published: 7/21/2025   |   Updated: 7/3/2025   |   Inventor(s): Yiting Zhu, Jean Paul Freyssinier, Yi-wei Liu, Dinusha Thotagamuwa, Nadarajah Narendran
Keywords(s): Circadian, Daylight, LED, Sensors
Category(s): Biotechnology and the Life Sciences
Method of directed self-assembly using diamagnetic levitation
RPI ID: 2015-021-403Innovation Summary:This invention introduces a novel system for directed self-assembly of microscopic electronic components using diamagnetic levitation. Unlike traditional 'pick-and-place' robotics used in electronic assembly, this approach allows components to position themselves using magnetic repulsion. A magnetic stage...
Published: 7/21/2025   |   Updated: 7/3/2025   |   Inventor(s): Jian-Qiang "James" Lu, Anton Tkachenko
Keywords(s): 2D arrays, Automation, Biomedical Engineering, Diamagnetic Levitation, Electrical Engineering, Electronic components, Electronics, Industrial Engineering, Integrated Chips, LED, LED dies, Lighting / Illumination, Materials, Mechanical Engineering, Optics, Optoelectronic Functionalities, Photonics, Self Assembly, Semiconductors, sparse arrays
Category(s): Energy, Environment and Smart Systems
Error-tolerant memory system design techniques
RPI ID: 2014-060-401Innovation Summary:This invention describes a memory architecture designed to operate effectively even when memory cells are defective or weak. The system identifies memory addresses associated with high error likelihood and applies customized handling, including virtual repairs, coding, and look-up mechanisms. It provides tiered...
Published: 7/21/2025   |   Updated: 7/3/2025   |   Inventor(s): Hao Wang, Tong Zhang
Keywords(s): Architecture, Building Engineering, color controllable lighting, dynamic lighting control, Electrical Engineering, Energy, Energy Management, LED, Lighting & Illumination Technology, Modulated Lighting, occupancy sensing, Optoelectronics Systems, pattern recognition, perturbation-modulated lighting, Sensors, Smart Lighting, Software, Solid State Lighting
Category(s): Energy, Environment and Smart Systems
Transformative LED Packaging
RPI ID: 2012-052-403 & 2012-052-601Innovation Summary:This dual-technology brief presents two innovations:A modular ultrasonic coupling system designed for high-pressure and high-temperature environments. It features a spring-loaded mechanism and viscous couplant to ensure consistent acoustic contact, enhancing the reliability of ultrasonic sensing...
Published: 7/21/2025   |   Updated: 7/3/2025   |   Inventor(s): Charles Goodwin, Robert, Jr. Karlicek, Jian-Qiang "James" Lu, Anton Tkachenko
Keywords(s): LED, LED/Optics, Structure
Category(s): Energy, Environment and Smart Systems