RPI ID: 2012-052-403 & 2012-052-601

Innovation Summary:
This dual-technology brief presents two innovations:
A modular ultrasonic coupling system designed for high-pressure and high-temperature environments. It features a spring-loaded mechanism and viscous couplant to ensure consistent acoustic contact, enhancing the reliability of ultrasonic sensing systems.
A magnetic assembly method for LED arrays that uses magnetic forces to guide and align LED dies suspended in fluid onto a substrate. This enables rapid, scalable, and precise assembly of high-density LED arrays.

Challenges / Opportunities:
Ultrasonic systems often struggle to maintain consistent coupling in extreme environments due to degradation of traditional couplants. The modular system addresses this with a robust, reusable design that ensures long-term signal integrity.
Simultaneously, traditional LED array assembly methods are slow and error-prone at micro scales. The magnetic assembly technique simplifies this process, reducing equipment needs and improving alignment accuracy. Together, these technologies offer scalable, high-performance solutions for sensing and optoelectronic manufacturing.

Key Benefits / Advantages:
✔ Consistent coupling: Maintains ultrasonic signal quality over time
✔ Modular design: Easy to install, replace, and customize
✔ Self-aligning assembly: Uses magnetic forces for precision LED placement
✔ Scalable and robust: Withstands harsh conditions and supports large-area manufacturing

Applications:
• Structural health monitoring
• Industrial process control
• LED display panels and solid-state lighting
• Wearable and flexible electronics

Keywords:
#UltrasonicCoupling #ModularSensorSystem #MagneticAlignment #LEDAssembly #HighTemperatureSensing

Intellectual Property:
US Issued Patents US9245875 and US9418979