RPI ID: 2015-021-403

Innovation Summary:
This invention introduces a novel system for directed self-assembly of microscopic electronic components using diamagnetic levitation. Unlike traditional 'pick-and-place' robotics used in electronic assembly, this approach allows components to position themselves using magnetic repulsion. A magnetic stage composed of alternating magnetic orientations generates nodes of stable levitation. When vibratory forces are applied, diamagnetic components naturally settle into these nodes without requiring individual manipulation. This method reduces reliance on complex and expensive robotic systems, particularly for large substrates or micro-scale components. The approach is scalable, energy-efficient, and compatible with materials like pyrolytic graphite that enable levitation at room temperature. It provides a flexible alternative to conventional methods for assembling displays, electronic textiles, and photonic systems.

Challenges / Opportunities:
As electronics become smaller and more integrated, existing manufacturing approaches struggle with speed, precision, and cost. Pick-and-place systems are costly and slow when dealing with micro-components across large areas. Alternative methods, such as laser-assisted transfer, often require high precision and expensive equipment. This invention offers a disruptive opportunity to simplify electronic component assembly using a non-contact, passive alignment method. It opens pathways for high-throughput manufacturing in applications such as flexible displays, smart surfaces, and micro-robotics.

Key Benefits / Advantages:
✔ Eliminates robotic pick-and-place
✔ Scalable to large-area substrates
✔ Non-contact assembly using magnetic fields

Applications:
• Microelectronic displays and LEDs
• Electronic textiles and wearable tech
• Photonic device assembly

Keywords:
#selfassembly #diamagneticlevitation #electronicsmanufacturing #magneticsorting

Intellectual Property:
US Issued Patent 10,199,247 B2