RPI ID: 2011-005-601

Innovation Summary:
This invention presents a composite thermal interface material (TIM) that achieves high thermal conductivity with low filler loading. It uses a nanostructured metallic network embedded in a polymer matrix, formed through controlled sintering.

Challenges / Opportunities:
Traditional TIMs require high filler content, increasing stiffness and complicating manufacturing. This invention achieves superior thermal performance with lower filler content, improving manufacturability and mechanical compliance.

Key Benefits / Advantages:
✔ High thermal conductivity: efficient heat transfer with minimal filler
✔ Mechanical flexibility: maintains compliance for delicate components
✔ Manufacturing friendly: easier to process and apply

Applications:
• Electronics cooling
• LED thermal management
• Power electronics
• Aerospace and automotive systems

Keywords:
#ThermalInterfaceMaterial #Nanocomposite #HeatDissipation #ElectronicsCooling

Intellectual Property:
US Issued Patent 9512291