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High thermal conductance thermal interface materials based on nanostructured metallic-network polymer composites
RPI ID: 2011-005-601Innovation Summary:This invention presents a composite thermal interface material (TIM) that achieves high thermal conductivity with low filler loading. It uses a nanostructured metallic network embedded in a polymer matrix, formed through controlled sintering.Challenges / Opportunities:Traditional TIMs require high filler content,...
Published: 7/21/2025
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Updated: 7/7/2025
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Inventor(s): Theodorian Borca-Tasciuc, Hafez Raeisi Fard, Sushumna Iruvanti, Fengyuan Lai, Kamyar Pashayi, Joel Plawsky
Keywords(s):
Category(s): Nanotechnology and Advanced Materials
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