RPI ID: 2016-011-201, 2016-011-602

Innovation Summary:
This technology offers a novel approach to non-destructive testing of VLSI circuits using terahertz (THz) and sub-THz radiation. The system directs THz waves onto a chip and detects signal variations at output pins, revealing connectivity integrity. This allows chip function and health to be verified under operating conditions (i.e., under bias), without opening the package or using intrusive probes. The technology accommodates high-density chips and small feature sizes that are challenging for traditional inspection methods. It supports detection of defects based on response amplitude, frequency, and spatial position of the probing beam. This innovation enables improved quality assurance in semiconductor fabrication and system-level hardware validation.

Challenges / Opportunities:
Current chip testing methods are destructive or invasive, often damaging components or requiring significant time and resources. They struggle with the miniaturization and complexity of modern integrated circuits. This invention provides a THz-based technique that is fast, non-contact, and compatible with in-situ analysis. It presents opportunities for improved reliability screening in IC manufacturing and final packaging QA.

Key Benefits / Advantages:
✔ Non-invasive VLSI integrity testing
✔ Works under bias conditions
✔ Scalable to high-density chip architectures

Applications:
• Semiconductor quality control
• IC packaging verification
• In-field diagnostics of embedded hardware

Keywords:
#terahertz #vlsitesting #noninvasive #chipdiagnostics

Intellectual Property:
US Issued Patent(s) 10,890,618 B2, US 11,675,002 B2