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Transformative LED Packaging
RPI ID: 2012-052-403 & 2012-052-601Innovation Summary:This dual-technology brief presents two innovations:A modular ultrasonic coupling system designed for high-pressure and high-temperature environments. It features a spring-loaded mechanism and viscous couplant to ensure consistent acoustic contact, enhancing the reliability of ultrasonic sensing...
Published: 7/21/2025
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Updated: 7/3/2025
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Inventor(s): Charles Goodwin, Robert, Jr. Karlicek, Jian-Qiang "James" Lu, Anton Tkachenko
Keywords(s): LED, LED/Optics, Structure
Category(s): Energy, Environment and Smart Systems
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