RPI ID:
2024-035-301

Innovation Summary:
This technology relates to advanced electro-optic modulator devices designed for integration into optical chips and photonic systems. The modulators utilize novel waveguide structures and modulation electrodes to achieve efficient light control. The design aims to reduce peripheral circuit complexity, minimize device footprint, and lower manufacturing costs. These devices are suitable for high-speed optical communication and signal processing applications.

Challenges / Opportunities:
Traditional electro-optic modulators often suffer from bulky designs and high power consumption, limiting their scalability in integrated photonic platforms. This invention addresses those limitations by offering a compact and cost-effective solution. It presents opportunities for next-generation optical networks, quantum computing interfaces, and miniaturized photonic circuits. The technology also supports broader adoption of integrated optics in commercial and defense sectors.

Key Benefits / Advantages:
✔ Compact design for integrated photonic systems
✔ Reduced peripheral circuit complexity
✔ Lower manufacturing and operational costs
✔ High-speed modulation capability
✔ Scalable for commercial and defense applications

Applications:
• Optical communication systems
• Integrated photonic circuits
• Quantum computing interfaces

Keywords:
Electro-optic modulator, integrated photonics, waveguide, optical chip, signal processing, high-speed communication

Intellectual Property:
WO2025137667A1 (Application PCT/US2024/061632), Published December 23, 2024