RPI ID: 2016-058-201
Innovation Summary:
This invention introduces a distributed thermal control system that utilizes solid-state heat pumps and thermal storage units to deliver localized heating and cooling. Each unit includes a proximity sensor, thermal storage material, and a heat distribution surface, enabling the system to respond dynamically to occupant presence and environmental conditions. The design supports simultaneous heating and cooling in different zones, improving both energy efficiency and occupant comfort. It is well-suited for integration into smart building environments.
Challenges / Opportunities:
Traditional HVAC systems are centralized and often inefficient, heating or cooling unoccupied spaces and wasting energy. This invention addresses the need for responsive, localized climate control by offering a distributed, sensor-driven solution. It opens opportunities in smart buildings, energy-efficient retrofits, and modular construction, where adaptive thermal management is essential.
Key Benefits / Advantages:
✔ Localized control delivers heating and cooling only where needed
✔ Energy-efficient operation reduces waste and utility costs
✔ Solid-state technology is quiet, compact, and reliable
✔ Smart integration with building automation systems
Applications:
• Smart homes and offices
• Modular and prefabricated buildings
• Energy-efficient retrofits
• Green building design
Keywords:
#thermalcontrol #solidstateheatpump #localizedHVAC #smartbuilding #energyefficiency
Intellectual Property:
US Issued Patent 12,135,143 B2
