RPI ID: 2005-028-201

Innovation Summary:
This invention presents a method for creating nanostructured surfaces that significantly improve mechanical bonding between materials. It utilizes nanoscale patterning to increase surface roughness and interlocking, enhancing adhesion without the need for chemical primers. The technique is compatible with a wide range of materials and is particularly suited for applications in microelectronics, aerospace, and biomedical devices.

Challenges / Opportunities:
Achieving strong mechanical bonds between dissimilar materials is a persistent challenge in many industries. Traditional adhesives may degrade or fail under mechanical or environmental stress. This invention offers a durable, scalable physical bonding enhancement that eliminates the need for chemical adhesives. It opens new opportunities in high-performance manufacturing and precision assembly.

Key Benefits / Advantages:
✔ Improved mechanical bonding
✔ No chemical adhesives required
✔ Scalable and reproducible
✔ Compatible with various materials

Applications:
• Microelectronics packaging
• Aerospace components
• Medical device assembly
• Structural adhesives

Keywords:
#Nanostructures #MechanicalBonding #Adhesion #SurfaceRoughness #Microfabrication

Intellectual Property:
US Issued Patent US7592376