RPI ID: 2004-005-201

Innovation Summary:
This invention introduces a novel class of command-cure adhesives that combine the benefits of extended working time with on-demand curing. The adhesive system consists of a reactive prepolymer mixture containing a catalyst and a monomer or oligomer component, which can be activated by actinic radiation (e.g., UV light). Once activated, the adhesive remains manipulable for a controlled period before undergoing thermal curing. This dual-stage curing process allows for precise control over bonding operations, making it ideal for applications requiring both flexibility and strong, permanent adhesion.

Challenges / Opportunities:
Traditional adhesives often force a trade-off between working time and cure speed. Fast-curing adhesives limit repositioning, while slow-curing systems delay production. This invention addresses both issues by enabling a “command” to initiate curing at a chosen time, followed by a thermal set. It opens opportunities in electronics assembly, aerospace, automotive manufacturing, and medical device fabrication, where precision and reliability are critical.

Key Benefits / Advantages:
✔ Extended working time with on-demand cure initiation
✔ Strong, durable bonds after thermal curing
✔ Compatible with oxetane and oxirane monomers/oligomers
✔ Ideal for precision assembly and high-performance applications

Applications:
• Electronics and circuit board assembly
• Aerospace and automotive component bonding
• Medical device manufacturing
• Industrial adhesives for precision fabrication

Keywords:
#commandcure #adhesives #uvactivated #thermalcure #precisionbonding

Intellectual Property:
US Issued Patent 7,235,593