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Wickless Heat Pipes Using Binary Liquid Mixtures
RPI ID:
2024-021-301
Innovation Summary:
This technology introduces a wickless heat pipe system designed to transfer thermal energy efficiently without relying on traditional wick structures. The system utilizes a novel internal geometry and fluid dynamics to enable capillary-free heat transport. The manufacturing method supports scalable production...
Published: 3/10/2026
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Updated: 3/10/2026
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Inventor(s): Joel Plawsky
Keywords(s): heat pipes, Interfacial Phenomena, Microelectronics Cooling
Category(s): Energy, Environment and Smart Systems
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