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Double Layer Hydronic Heating and Cooling System for Buildings
RPI ID: 2021-074-201Innovation Summary:This invention presents a hydronic system embedded within a building partition that enables both heating and cooling through fluid circulation. The system includes conduits on either side of a partition, each covered by finishing materials, and is controlled by valves and pumps that regulate fluid flow in different...
Published: 7/21/2025
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Updated: 7/3/2025
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Inventor(s): Theodorian Borca-Tasciuc, Youngjin Hwang, Alexandros Tsamis
Keywords(s): Climate Adaptive Building System, Cyber Physical Heating and Cooling, Hydronic, Micro-Capillary
Category(s): Energy, Environment and Smart Systems
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